Principal Engineer, Physical Design (AI2481)
SiMa.ai
Date: 2 weeks ago
City: Bengaluru, Karnataka
Contract type: Full time
Description
Job Title: Principal Engineer, Physical Design
Job Location: Bangalore, India (This position requires a full-time, on-site presence in our Bangalore, India Office)
Job ID: AI2481
Job Description
Role & responsibilities:
Can-do attitude. Strong team player. Curious, creative and good at solving problems. Execution and results-oriented. Self-driven, Thinks Big and is highly accountable. Good communication skills.
Job Title: Principal Engineer, Physical Design
Job Location: Bangalore, India (This position requires a full-time, on-site presence in our Bangalore, India Office)
Job ID: AI2481
Job Description
Role & responsibilities:
- Hands-on SoC/Full-chip floorplanning, integration and P&R along with P&R Flow Development
- Establishes the integration plans for die with optimization for package and board constraints.
- Bump planning, Die file generation, closing loop with package team on signal and power bump placement restrictions.
- Create physical database for the IP or SoC. Collaborate with architects to optimize the placement of IPs for latency as well as die area/aspect-ratio.
- Collaborate with the design teams on clocking and dataflow to deliver the physical block level floorplans for APR.
- Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies.
- Coordinate with power delivery team on trade-offs for metal allocation for signal and power.
- Have excellent understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization.
- Performs integration of all dies in a package and completes the relevant checks before tape-out.
- Supervise/lead/mentor junior team members.
- BE/BTech or ME/MTECH with at least 15+ years of experience on high complexity SoC designs. At least one SoC in 7nm or lower.
- Demonstrating knowledge and implementation strategies to create an IO ring in accordance with design specifications.
- Possessing deep knowledge of ESD, latch-up, and other foundry requirements, as well as placement strategies.
- Having hierarchical design implementation knowledge, including partitions/HMs/tiles push down to each core/tile.
- Understanding feed-through planning and implementation.
- PG creation and push-down methodologies.
- Understanding Analog components and their placement requirements according to design specifications.
- Demonstrating RDL knowledge and working with packaging for SoC floorplan design.
- Conducting PV clean-up on floorplan and ensuring self-derivation in all sign-offs, including Physical Verification, ESD, foundry/Analog requirements.
- Working knowledge of PnR implementation, physical verification, and STA
- SoC RTL to GDSII implementation, with top level clocking strategizing and implementation.
- P&R flow owner which includes but not limited to scripting, flow deployment for SoC & Blocks
- Following expertise is a plus:
- In-depth knowledge of Physical Verification tools like Synopsys ICV & Calibre Physical Verification Tools
- Knowledge of Package PV checks, IO/Bump PV cleanup, PV rules viz. Antenna, Density, DFM, DFY, DPT at lower technology nodes 7nm or less.
- Led PV activities on SoC designs with expertise in DRC, LVS, DFM, HV checks and cleanup.
- Expertise in running PV checks on Flat/Hierarchical SoC designs with multiple power domains.
Can-do attitude. Strong team player. Curious, creative and good at solving problems. Execution and results-oriented. Self-driven, Thinks Big and is highly accountable. Good communication skills.
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